Products

LAPPING/POLISHING CARRIERS

For the purpose of manufacturing high quality semiconductor wafer, the sliced wafer from a silicon ingot requires surface flatness by specular finish and highly uniform thickness. The wafer production processes of ensuring such precision surface flatness and planarization are called lapping and polishing processes.

With the features below, our unique lapping/polishing carriers enable the production of ideal silicon wafers of various sizes: 100, 125, 150, 200 and 300 millimeters.

(FEATURES)

1. The materials of our lapping/polishing carriers include carbon tool steel, stainless steel and other superhard metals. Compared to resin and ordinary steel carriers, our carriers stand longer use due to the highly durable materials.
2. The high rigid of our carriers permits a silicon wafer to have high-precision surface flatness and planarization.
3. The carriers are machined by using a CNC laser machine, and can be customized to suit any design and complicated shapes.

INSERT LAPPING/POLISHING CARRIERS

The carrier with a plastic insert which is firmly bonded at the circumference of an inner hole is called the insert lapping/polishing carrier.

The plastic insert and steel carrier work monolithically to protect the edge profile of a silicon wafer. As a result, the insert carrier can increase the production yield of silicon wafers, preventing chips, cracks and scratches on a silicon wafer in lapping and polishing processes.

Based on the size of a silicon wafer and the customer’s requirements, the materials of insert are carefully chosen from nylon66, polyacetal (POM) and other special plastic or plastic fiber.

The know-how accumulated by Kishida Manufacturing Group over the years allows us to manufacture the insert lapping/polishing carriers in compliance with any demand and requirement from customers.

DICING FRAME

In wafer production processes, there is a process called “dicing process”, which is to dice a silicon wafer, more specifically, cut out a silicon wafer into hundreds of chips. A special jig, “Dicing Frame”, otherwise known as “Wafer Ring” is used to hold a silicon wafer in the process.

We can manufacture any type of dicing frame to meet customers’ specifications.

CUSTOM LASER-CUT PARTS/PRODUCTS

Apart from a variety of carrier and dicing frame products, GMTC also manufactures sheet metal products and precision metal parts for ATM, automobile and machinery.

The following samples are our custom laser-cut parts/products, which include not only laser-cut process but also bending, drilling and welding processes: